About this role
Envision Employment Solutions is currently looking for a Physical Design SiP Architect for one of our partners, an IT Services and IT Consulting company.
THE ROLE
As chiplets and system in package designs take over, the architecture no longer stops at the die edge. You'll define the physical architecture of SiP solutions, bringing dies, packaging, power, thermal and signal integrity together into one design that works as a system.
WHAT YOU'LL DO
Define and document the physical architecture for system in package and chiplet based designsLead architecture decisions on partitioning, die to die interfaces and package integrationDrive power analysis, power integrity, thermal analysis and EMI considerations at package and system levelGuide place and route and physical implementation strategy across diesUse system modelling (such as SystemC) to evaluate architecture options, including RISC based subsystemsWrite and own architecture definition documentsWork across design, packaging and system teams to close on performance, power and cost
WHAT WE'RE LOOKING FOR
10+ years of experience in physical design and/or SoC architectureHands on experience with SiP, chiplet or advanced packaging projectsStrong understanding of power integrity, thermal analysis and EMISolid place and route and physical design backgroundExperience with SystemC modelling and RISC based architecturesStrong architecture documentation skillsAbility to lead technical decisions across multiple teams
YOU'LL THRIVE HERE IF YOU
You think about the whole package, not just the dieYou enjoy weighing power, thermal and signal trade offs togetherYou write architecture documents that people actually followYou're excited about where chiplet technology is headingYou can bring design and packaging teams to one decision