About this role
FII USA, Inc ., a Foxconn Technology Group Company, is seeking a Failure Analysis Engineer to perform engineering investigations of significant customer field and line escalations related to hardware issues and collaborate with numerous internal engineering disciplines to resolve hardware issues. Once a part of the team, you will be responsible for a wide variety of tasks within the L10/L11 Test Engineering Department in an office environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing. The Failure Analysis Engineer will monitor test failure trends in NPI, provide corrective actions to improve production test yields, and assist this L10/L11 Test Engineering Department as needed. Interface with customers and internal cross-functional teams to root cause hardware issues to the component level Perform engineering investigations of significant customer field and line escalations related to hardware issues Monitor test failure trends in NPI and provide corrective actions to improve production test yields Design and develop debug tools to improve debug process and efficiency Provide training to technicians and debug team on new and existing debug procedures and product troubleshooting Support internal communications of techniques and processes for WW RMA & Service Centers Drive "best practices" across WW Operational, RMA & Service Sites Program manage CSP/Enterprise account Reliability requirements Facilitate Reliability strategy discussions Other duties as assigned