About this role
FII USA, Inc., a Foxconn Technology Group Company, is seeking a Test Engineer to develop and manage test processes and expand test capacity for printed circuit board assemblies. Once a part of the team, you will be responsible for a wide variety of tasks within the Testing Department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing. The Test Engineer will develop plans for process optimization and test capacity utilization for Surface Mount Technology (SMT) lines, support new product introductions, and assist the Testing Department as needed. Develop and implement plans for test processes and test capacity utilization across SMT production lines. Manage and maintain functional test programs for PCBA testing. Train and develop operators on proper use of test equipment and test procedures. Provide technical support to SMT operations related to testing and drive optimization of test processes. Support test engineering validation for new PCBA products and prepare detailed NPI reports and recommendations for customers. Track daily repairs and downtime of production test equipment; analyze data and recommend corrective actions to improve test efficiency. Review current test equipment and facilities against present and future requirements to ensure test readiness and customer satisfaction. Coordinate with vendors and procurement teams to source fixtures, tooling, and equipment required for test setups. Troubleshoot electronic PCBAs and assemblies and recommend process or design improvements. Coordinate with Maintenance to drive preventative maintenance programs for test equipment. Act as a technical escalation point for daily production test issues, responding to line requests and engaging external resources as needed. Participate in PFMEA activities and New Product Introduction (NPI) projects. Other Duties as assigned.