About this role
Senior Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics. Location: Ipoh, Perak, Malaysia. Role: supporting engineering, improving yield, managing ramp Requirements: Bachelor's in engineering,10+ years semiconductor packaging/assembly experience,3+ years leading technical projects,expertise in assembly processes,yield analysis,process control,qualifications and NPI-to-HVM transfers. Category: Engineering Seniority: Mid Level Commitment: Full Time Workplace: Onsite Languages: English