About this role
Lead Optical Packaging Engineer at GPD Optoelectronics. Location: Salem, New Hampshire, United States. Role: designing packages, developing processes, mentoring staff Requirements: BS in mechanical engineering/material science or related, 8+ years industrial experience in semiconductor or photonics die packaging, familiarity with die attach/wirebonding/flip chip/seam seal, DOE/DFSS experience, ability to lift 20 lbs, travel <10%. Category: Engineering Seniority: Senior Level Commitment: Full Time Workplace: Onsite Languages: English