About this role
Lead Optical Packaging Engineer at GPD Optoelectronics. Location: Salem, New Hampshire, United States. Role: developing packaging, leading teams, designing packages Requirements: BS in engineering or materials, 8+ years semiconductor/photonics die packaging experience, expertise in packaging techniques, DOE and root-cause methods, ability to lead cross-functional teams. Category: Engineering Seniority: Senior Level Commitment: Full Time Workplace: Onsite Languages: English