About this role
Die Attach - Operator, Assembly at GPD Optoelectronics. Location: Salem, New Hampshire, United States. Role: managing wafer, optimizing process, overseeing operators Requirements: BS in Engineering or Physics, extensive semiconductor/wafer fabrication experience, familiarity with III-V materials, ability to follow cleanroom/MIL-STD/ITAR rules, lift up to 75lbs, Lean/Six Sigma experience preferred. Category: Skilled Trades - Manufacturing and Industrial Seniority: Senior Level Tools: RIE, PECVD, Photolithography, Optical coatings, Wet chemical processing, Metallization, Grinding, Lapping, Polishing, Saw, Scribe Certifications: six sigma, lean Commitment: Full Time Workplace: Onsite Languages: English