About this role
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Join our Engineering Operations Team as an Electrical Contract Manufacturer Support Engineer, where you will be responsible for developing, qualifying, and sustaining advanced assembly and interconnect processes used in high-performance electronic products. You will work across the entire product lifecycle, from New Product Introduction (NPI) through volume manufacturing, driving process optimization, yield improvement, and root cause analysis.
In this role, you will support complex assembly technologies including SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow soldering, hot bar soldering, laser soldering, flip-chip assembly, and advanced packaging solutions. You will leverage inspection and analytical techniques such as X-ray analysis, cross-sectioning, microscopy, and reliability testing to ensure robust manufacturing processes and superior product quality. Our collaborative environment encourages innovation, technical leadership, and continuous improvement while solving challenging manufacturing problems.
NILightpath
- Develop, optimize, and qualify advanced electronic assembly processes, including surface-mount assembly, through-hole technologies, precision soldering methods, component attachment, and advanced packaging solutions.
- Define, validate, and maintain robust manufacturing process windows to ensure consistent quality, reliability, and production performance.
- Support products through the full manufacturing lifecycle, from early prototype builds and process development to high-volume production readiness.
- Conduct process characterization activities, experimental studies, and capability assessments to identify opportunities for continuous improvement.
- Lead root cause investigations and failure analysis activities to resolve manufacturing, quality, and reliability challenges.
- Perform detailed inspections and analysis to evaluate assembly integrity, identify defects, and improve manufacturing outcomes.
- Drive initiatives that improve yield, product quality, manufacturing efficiency, and cost effectiveness.
- Collaborate with cross-functional teams and external partners to enhance manufacturability, assembly processes, reliability, documentation, and production readiness.
Must-Have
- 4-6 years of experience
- BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
- Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
- Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
- Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
- Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.
Nice-to-Have
- Familiarity with non-destructive inspection, cross-sectional analysis, failure analysis, or advanced material characterization methods.
- Exposure to high-performance electronic products, optical or RF technologies, semiconductor manufacturing, or photonics-related applications.
- Experience applying statistical methods, experimental design, yield improvement, or continuous improvement methodologies in a manufacturing environment.
- Familiarity with manufacturing automation, digital manufacturing, smart factory initiatives, or Industry 4.0 technologies.