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Electrical Engineering Student @ Nokia

Ottawa, Ontario, CAOnsiteFull-timeJob reference 32826
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About this role

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.

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If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

Position: Electrical Engineering Student

Number of Position(s): 1

Duration: 4 Months

Start Date: January 4, 2027

Location: Onsite - Ottawa, Canada

Educational Recommendations: Currently enrolled in a Electrical Engineering program or a related field with an accredited school in Canada.

  • Support the electrical design of optical pluggable modules, balancing electrical performance, signal integrity, and manufacturability requirements.
  • Perform electrical verification testing using lab equipment, review schematics and layouts, and assemble prototypes.
  • Support the transition of designs to production with minimal redesign.
  • Interface with suppliers/contract manufacturers to resolve electrical issues.
  • Author Engineering Change Orders (ECOs) and Bills of Materials (BOMs).
  • Define and validate labeling, packaging, and regulatory compliance requirements.
  • Partner with mechanical, optical, manufacturing, and test teams to propose innovative solutions that improve product performance, cost, and reliability.
  • Assist with root-cause analysis of field issues and support ongoing engineering efforts.

You're a great fit if you have:

  • Experience with circuit simulation tools, layout techniques, and standard laboratory test equipment (e.g., oscilloscopes, network analyzers).
  • Experience with optical transceiver packaging (e.g., QSFP, OSFP) and ASIC packaging.
  • Knowledge of advanced substrate technologies (e.g., organic build-up, LTCC, HTCC, and high-performance PCB laminates).
  • Basic understanding of signal integrity and power integrity principles.

Skills

circuit simulationlayout techniquesoptical transceiver packagingASIC packagingsubstrate technologysignal integrityPower Integrityengineering change orderbills of materialRoot Cause Analysis

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