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Mechanical Engineer Student @ Nokia

Ottawa, Ontario, CAOnsiteFull-timeJob reference 41687
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About this role

Position: Mechanical Engineer Student

Number of Position(s): 1

Duration: 4 Months

Start Date: January 4, 2027

Location: Onsite - Ottawa, Canada

Educational Recommendations: Currently enrolled in a mechanical engineering program with an accredited school in Canada.

In this role, you will collaborate with a world-class team of engineers to support the design, modeling, and testing of advanced optical technologies. This position offers a unique opportunity to balance thermal, structural, and manufacturability requirements while gaining hands-on experience in CAD design, Finite Element Analysis (FEA), thermal modeling, and New Product Introduction (NPI) processes. You will work cross-functionally across global locations to help transition innovative concepts into reliable, high-performance products.

  • Support the mechanical design of optical pluggable modules.
  • Review CAD models, detailed drawings, and conduct tolerance and stress analyses.
  • Perform thermal and mechanical design verification testing (DVT) and assemble prototypes.
  • Support the transition of designs to production with minimal redesign.
  • Interface with suppliers/contract manufacturers to resolve integration issues.
  • Author Engineering Change Orders (ECOs) and Bills of Materials (BOMs).
  • Define and validate labeling, packaging, and regulatory compliance requirements.
  • Partner with electrical, optical, manufacturing, and test teams to propose innovative solutions that improve product performance, cost, and reliability.
  • Assist with root-cause analysis of field issues and support ongoing engineering efforts.

You're a great fit if you have:

  • Experience with optical transceiver packaging (e.g., QSFP, OSFP) and ASIC packaging.
  • Knowledge of compliance, shock, and vibration testing for telecommunications applications.
  • Familiarity with advanced substrate technologies (e.g., organic build-up, LTCC, HTCC, and high-performance PCB laminates).
  • Basic knowledge of thermal modeling, FEA, and CAD design tools.

Skills

CAD designfinite element analysisthermal modelingoptical transceiver packagingengineering change orderbills of materialRoot Cause Analysisvibration testing

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