About this role
FII USA, Inc. , a Foxconn Technology Group Company, is seeking an Advanced Repair Technician with expert-level skills in BGA and advanced component rework. This role supports high-complexity board repairs and utilizes advanced diagnostic and rework tools in a precision repair environment. The Advanced Repair Technician will be responsible for repairs involving Ball Grid Array components and other high-density board technologies, using equipment such as ERSA or SUMMIT rework systems. Perform advanced diagnostics and root cause analysis on complex PCB failures Execute expert-level soldering and de-soldering, including BGA, SMT, and fine-pitch components Operate high-end rework equipment, including BGA Rework Stations (ERSA, SUMMIT, etc.) Interpret and work from circuit schematics and engineering documentation Maintain detailed records of repair actions and results for traceability Train junior technicians on advanced repair methods and standards Ensure compliance with IPC-7711/21 and quality management systems Support process improvement initiatives within the repair department Other duties as assigned