About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.
• Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals. • Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams. • Understand detailed customer requirements and verify latest technologies meet or exceed all expectations. • Document findings and process flows to create baseline for new technology platforms. • Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis. • Updates customer assembly application notes.
• MS Degree in Material Science, Chemical Engineering, Semiconductor Processes or other relevant technical field. • Strong communication skills. • Ability to lead development projects and implement strategies on a global basis. • Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding. • Knowledge of materials and material interactions. • Strong English conversational skills.