About this role
Sr. Staff Packaging Engineer at Renesas Electronics. Location: Bayan Lepas, Penang, Malaysia. Role: designing package, developing processes, qualifying packages Requirements: Requires 5+ years in package development (leadframe, laminate, power SiP/module, flip-chip). Masters/Bachelors in engineering or physical sciences, proficiency with AutoCAD and Microsoft Office, strong analytical and communication skills. Category: Engineering Seniority: Senior Level Tools: AutoCAD, Microsoft Excel, Microsoft PowerPoint, Microsoft Word Commitment: Full Time Workplace: Onsite Languages: English