About this role
Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics. Location: Shah Alam, Selangor, Malaysia. Role: improving yield, supporting NPI, managing quality Requirements: Bachelor's degree in engineering, 8+ years semiconductor packaging and manufacturing experience, 1+ years leading technical projects, expertise in IC assembly processes, yield analysis, SPC/DOE, NPI-to-HVM transfers, and OSAT coordination. Category: Engineering Seniority: Entry Level Commitment: Full Time Workplace: Onsite Languages: English