About this role
Lead Packaging Engineer at Diraq. Location: Palo Alto or Los Angeles or Boston or Chicago or Sydney. Role: designing packaging, leading development, conducting analysis Requirements: Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing. Category: Engineering Seniority: Senior Level Commitment: Full Time Workplace: Onsite Languages: English