About this role
Lead Packaging Engineer at Diraq. Location: Sydney or Palo Alto or Boston or Los Angeles or Chicago. Role: leading packaging, designing substrates, analyzing failures Requirements: Bachelor's degree in engineering or materials science, significant semiconductor packaging experience, PCB/substrate and mechanical design expertise, failure analysis, thermal management, and cross‑disciplinary collaboration skills. Category: Engineering Seniority: Senior Level Commitment: Full Time Workplace: Onsite Languages: English