About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Lead product engineering activities for Advanced Power Modules in the New Product Development (NPD) division. This role focuses on developing next-generation power modules using advanced embedded packaging technologies, such as chip embedding and interposer-based integration, to achieve high performance and reliability. You will ensure manufacturability, quality, and robustness through prototype builds, qualification runs, and validation processes, collaborating with global cross-functional teams to deliver automotive-grade solutions.
• Prototype & Qualification Builds • Plan and execute prototype and qualification runs for embedded power modules, ensuring compliance with NPD phase-gate requirements. • Validate build integrity and maintain accurate documentation of process parameters and outcomes.
• Advanced Embedded Packaging • Apply expertise in chip embedding, interposer integration, and thermal/electrical optimization for module development. • Perform process characterization and data analysis to optimize yield, reliability, and performance.
• Failure Analysis & Issue Resolution • Conduct root-cause analysis for product issues and collaborate with design, process, and reliability teams to implement corrective actions. • Document lessons learned and integrate improvements into future builds.
• Cross-Functional Collaboration • Work closely with design, technology development, and manufacturing teams to ensure smooth transition from development to production. • Communicate status, risks, and mitigation plans proactively to global stakeholders.
• Compliance & Release • Confirm qualification evidence meets internal standards before product release. • Support audits and maintain traceability of product engineering deliverables.
• Bachelor’s degree in engineering (advanced degree preferred). • 10+ years in semiconductor product engineering with strong experience in power module development. • Proven expertise in power semiconductor technologies. • Familiarity with advanced embedded packaging technologies (e.g., chip embedding, interposer-based integration). • Strong skills in SPC, DOE, and data-driven problem solving. • Excellent communication and collaboration skills for global team environments. • Highly organized, self-motivated, and passionate about continuous improvement.