About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Job Summary:
onsemi (Nasdaq: ON) is hiring a self-directed and self-driven GaN/BCD Process and Technology Development Engineer for external foundries.
• Process Integration: • Collaborate with R&D and foundry to develop/optimize GaN/BCD power devices and processes to deliver device manufacturability and production yield • Work closely with foundry and multi-functional teams to bring up NPI
• Improvement of yield and quality: • Perform advanced device characterization • Conduct detailed yield analysis to identify failure modes. Drive yield and quality improvement actions at defect and module levels at foundry • Implement statistical process control (SPC) and design of experiments (DOE) methodologies to improve process yield.
• Project Management: • Manage multiple projects, ensuring timely delivery to the solution and meet milestones. • Coordinate with cross-functional teams to align project goals and deliverables.
Requirements:
• Education: • MS or PhD in Electrical Engineering, Physics, or Material Science
• Experience: • In-depth knowledge of GaN/BCD power device physics, process flow, integration and yield analysis. Module experience is a plus. • Proven track record in new process development/optimization and/or yield improvement in GaN and BCD technologies • Experience working with foundries RD/engineering/quality teams. • Extensive experience with device reliability mechanisms, physical and device characterization techniques and failure analysis. • Experience of managing a full process of new product introduction, including test chip, tapeout, IP merges, masks, to deliver 1st Silicon success, as well as enabling new technology joint development in external foundries.
• Soft Skills: • Excellent written and verbal communication and presentation skills in English • Strong project management abilities. Multi-tasking and good adaptability in a fast-changing environment. • Ability to work in collaboration and in leadership. • Self-driven, motivated, and excellent in problem solving skill with exceptional analytical and persuasion on directions.