About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Sustain and optimize the Wafer Saw (Die Preparation) process to achieve high performance in yield, quality, cycle time, and cost, while ensuring robust process control and supporting capacity expansion.
• Own and sustain Wafer Saw / Die Preparation processes. • Define, optimize, and control sawing parameters (blade type, feed rate, spindle speed, etc.) • Drive yield improvement, defect reduction, and process capability enhancement • Lead failure analysis related to chipping, cracking, contamination, and die defects • Establish and maintain SPC controls, FMEA, and control plans • Support new product introduction (NPI) and process qualification • Identify and implement cost reduction and productivity improvements • Evaluate and qualify materials, tooling, and equipment suppliers • Lead continuous improvement projects and capacity expansion initiatives • Ensure complete and accurate process documentation and standardization
• Bachelor’s Degree in Engineering (ME, EE, IE or equivalent) • Minimum of 3 years Process Engineering experience in semiconductor manufacturing with hands-on experience in Wafer Saw / Die Preparation • Strong knowledge of Wafer Saw processes, materials, and defect mechanisms • Understands DFD6240, DFD6340/1, DFD6361/2, ADT2000, Laser Groove and other die preparation equipment. • Proficiency in SPC, DOE, Data Analysis, FMEA, Control Plan and Change Management • Solid problem-solving and root cause analysis (RCA) skills • Ability to manage multiple priorities in a high-volume environment • Strong technical ownership and decision-making capability • Effective cross-functional communication and collaboration • Experience in different FOL processes is an advantage