About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
• New package technology and platform module development (Si-gel filled module). • Technical leadership on new power module technology and enabling technology for automotive/industrial application. • Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team. • Package/design review for new package development, on-tme release with the first pass success (qualification). • Present technical finding, design review and recommendation to stakeholders and management. • Lead package related failure analysis, reliability testing and debug package issues. • Participate in customer meeting, provide technical clarification and support failure investigation.
• Define power module package strategy aligned with product roadmap. • Own end-to-end package development from concept to qualification upon company's package development procedures. • Ensure package reliability, performance, and manufacturability. • Establish and optimize packaging processes and specifications. • Collaborate with cross-functional teams (design, wafer fab, test, product engineering). • Evaluate and introduce new packaging technologies and materials. • Manage risk, cost, and schedule for packaging programs. • Support customer engagement for technical discussions and issue resolution. • Serve as subject matter expert (SME) for packaging within the organization.
• Minium Bachelor's degree of material science or mechanical engineering. • More than 8 years of power module package development experience including transfer to the production. • Preferred Si gel filled module package development experience with SiC device. • Good statistical analysis skills with Minitab or JMP. • Preferred the knowledge to use Auto CAD software • Good communication skills with English.