About this role
The Integrated Circuits & Microsystems Research Lab at Bell Labs is looking for a talented Opto-electronics ASIC Researcher. You will perform leading research and development in the design and characterization of optoelectronic interfaces and integrated subsystems for high-speed optical networks. You will drive research into novel integration techniques, integrated circuit architectures, and optoelectronic interfaces to push the boundaries of performance and efficiency.
• Work closely with Nokia Bell Labs researchers and business units to identify key technologies for optical sub-systems. • Translate ASIC architectures into transistor-level circuit schematics and layouts, including driver/modulator and photodiode/TIA interconnects. • Characterize manufactured ICs using high-frequency test & measurement techniques and wireline modulation formats. • Collaborate on the assembly and integration of ICs with photonic integrated circuits. • Document and present research outcomes to internal and external audiences, including travel to international conferences. • Drive research into novel integration techniques and circuit architectures. • Push the boundaries of performance and efficiency in high-speed optical networks. • Maintain strong interpersonal skills and collaborate effectively with a multi-disciplinary team.
• Ph.D. in Electrical Engineering or Physics (or Master's with 5+ years' experience) is required. • Proven track record of successful tape-outs in state-of-the-art semiconductor technologies, preferably SiGe BiCMOS. • Strong technical writing and communication skills are essential. • Experience in designing and characterizing high-speed analog and mixed-signal wireline circuits. • Proficiency in industry-standard IC toolchains, such as Cadence Virtuoso & EMX, Keysight ADS, and Ansys HFSS. • Hands-on experience with high-frequency test & measurement equipment is a must. • Experience with ultra-high signal frequencies (100 GHz+) is desirable. • Knowledge of semiconductor fabrication processes, IC packaging, and microelectronics assembly is a plus. • Skills in system modeling or digital signal processing for wireline communications are advantageous. • Design experience or knowledge of photonic integrated circuit components is preferred.