About this role
The Technical Department Head for High-Speed Optical ASICs, Packaging & Integration Research will lead a team of Bell Labs researchers in defining, advancing, and demonstrating next-generation integrated circuit technologies for optical communications and related high-speed connectivity applications. Working closely with Nokia business groups and external partners, the department head will shape research directions, guide system and architecture exploration, and oversee the development of high-performance optical integrated circuits, advanced packaging approaches, and heterogeneous integration solutions that enable future optical networks.