About this role
Within the project, your main tasks will include:
Placing electronic components (ICs, resistors, capacitors, connectors, etc.)Routing signal, power, and ground tracesManaging multilayer stack-upsEnsuring signal integrity, EMC/EMI, thermal performance, and reliabilityApplying design rules and manufacturing constraints (DFM, DFA, DFT)Preparing manufacturing files (Gerbers, ODB++, pick-and-place, BOM) With a Master’s degree (BAC+5) from an engineering school or university specializing in embedded systems, you have a 1st successful experience in the field of electronics, HW engineer or physical layout of PCBs.
Strong understanding of electronics and schematicsKnowledge of PCB manufacturing processesIPC standards knowledge (IPC‑2221, IPC‑7351, IPC‑A‑610 is a plus)Signal integrity and power integrity basicsAttention to detail and precisionAbility to read datasheets and application notesProblem-solving and cross-team communication