About this role
The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics. At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day. Show the world what you are made of.
- Your new responsibilities Develop packages & package technologies for digital photonics (datacom, AR/VR) and optical sensors (ambient light, color, proximity) as part of the engineering team Carry out package design (mechanical & optical design, bill of materials, simulations) and manufacturing at assembly partners Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams Execute package development to successful completion within given resource constraints (time, budget) Continuously improve package technologies to achieve time, quality and cost targets Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality Identify and introduce cost improvements for high volume production Identify and develop new suppliers / technologies Who we are looking for Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields 10 year+ experience in advanced semiconductor packaging Technical modelling and drawing in SolidWorks and AutoCAD beneficial Experience in high volume manufacturing for consumer electronics applications is a benefit Experience in collaboration with external manufacturing partners (OSATs) Failure analysis and reliability engineering knowledge, basic knowledge of MEMS and CMOS manufacturing technologies Demonstrated analytical and problem-solving skills, hands-on-mentality, ability to execute developments within tight resource constraints (time, budget) Ability to cope with high workloads in critical project stages and collaborate with diverse teams in multiple geographical locations Strong communication skills, creativity and problem-solving skills Openness to business travel for several weeks per year Fluent in English We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G ( https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/) . We offer a higher compensation depending on your expertise and skills.
Please contact Hana Krsul for further information via [email protected] or +43 664 9665611 .