About this role
We are looking for a Product Engineer to own the production health of millimeter-wave (mmWave) RF Digital Beamforming (DBF) and RF front-end ASICs in high-volume manufacturing for our customer terminal and satellite products. This is a data-driven, decision-making role. You will own end-to-end production for assigned ASICs and be the engineer accountable for whether material ships. You will work in a fast-moving, cross-disciplinary team to own yield and ensure high quality, maintain test program health across various products, debug issues with fab/OSAT partners, and drive on-going reliability efforts.
Key job responsibilities
Yield and lot disposition
- Own yield for assigned products across fab, bump, wafer sort, assembly and final test, and drive improvement against entitlement.
- Analyze WS and FT data to identify outliers, wafer map signatures and parametric drift.
- Make lot disposition decisions on held material, release, re-screen or scrap, and document the basis for each.
- Own OCAP response for SPC and yield excursions, and close corrective actions with the foundry and OSAT.
- Define and maintain outlier screening rules including SBL, SYL, PAT and geographical ink-out. Test program, limits and test hardware
- Own production test limits, including limit proposals, GR&R guard-banding and coverage changes.
- Balance test coverage against test time, UPH and cost per unit, and drive test cost reduction.
- Own probe card and load board qualification and buy-off, including calibration tracking and first-pass buy-off rate.
- Work with Test Engineering to validate test program revisions before production deployment. Production data systems and reporting
- Build and maintain automated WS/FT reporting, yield dashboards and KPI tracking.
- Develop analysis routines to automate reporting, and flag anomalies.
- Maintain die-level traceability from bump through final test.
- Present yield, quality and production status in weekly reviews and quarterly business reviews. Quality, RMA and failure analysis
- Lead root cause investigation on QA failures, RMA returns and field escapes, and drive cases to closure.
- Own 8D and corrective action reporting for customer-facing quality events.
- Coordinate with external FA labs for physical analysis including TEM, SEM, FIB, OBIRCH, EMMI and lock-in thermography.
- Work with Design and Test to determine whether a failure is product, process or test related, and verify corrective action effectiveness. Qualification and change management
- Qualify supplier-initiated Process Change Notifications and second-source material, comparing control against change material at the margin level rather than against test limits alone.
- Define sample plans, stress conditions and acceptance criteria per JEDEC standards.
- Own qualification status documentation and product reliability records. Cross-team and OSAT collaboration
- Act as the production engineering interface to OSAT and foundry partners on yield, quality and test issues.
- Support production readiness reviews, production transfer checklists and new product introduction.