About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Provide the necessary support for new package development initiatives, project and program management, and continuous improvement activities to drive best-in-class performance at the onsemi Carmona site. These efforts are focused on enhancing operational excellence, improving manufacturing and business performance, achieving superior quality and delivery outcomes, and driving sustainable cost reductions through effective project execution, process optimization, and productivity improvements.
- Spearhead, lead, and support project champions in collaborating with cross-functional teams to align with KPI metrics and achieve targets.
- Support the development of projects and programs to meet the goals of the Operational Excellence Department.
- Lead and manage BOM-related projects and product development, including qualifying new suppliers and introducing cost-effective BOM and process types—from qualification and manufacturing validation to safe launch and mass production release.
- Review engineering builds and complete assembly build requests, qualification reports, and production release documentation.
- Provide support for all manufacturing requirements related to equipment and maintenance.
- Perform other related project activities as assigned.
- Demonstrate the ability to multi-task and organize work systematically to meet deadlines without compromising quality.
- Support and improve wire bonding (WB) equipment and processes to enable device and platform proliferation and ensure product and process robustness.
Job Specifications
- Minimum of seven years of direct experience in semiconductor operations.
- Bachelor’s degree in Engineering (Mechanical, Electrical, Electronics, or Materials Science).
- Extensive experience in New Package/Product Engineering, with specific expertise in assembly processes. Knowledge of metallurgy and materials science is an advantage.
- Good interpersonal skills in collaborating with support groups
- Highly motivated to work in a dynamic environment, with good integrity and character
- Basic understanding of and ability to apply statistical analysis
- Excellent communication skills
Skills
- Specific Assembly Process expertise
- Working knowledge of DOE / 6 Sigma Statistical Tools
- Working knowledge on large scale, safe launch and pre-production releases
- Working knowledge on Control Plan / FMEA, 8D and Problem Solving
- Background on Program Management, Problem Solving Skills and Business Acumen and Strategic Thinking .
- Proficient in Microsoft Office
- AutoCAD and 3D modelling is an advantage