About this role
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 78946 Description Skyworks is seeking a Principal Research Scientist to serve as a principal investigator and key individual contributor leading the development of next-generation wafer-level interconnects (BEOL), wafer-level packaging (WLP) approaches, and heterogeneous integration technologies. The ideal candidate is a demonstrated leader with a track record of innovation, proposal development, and successful funding capture, as well as experience guiding small R&D teams to deliver focused, high-impact results.
This role requires driving the creation of transformational, differentiated integrated circuit and packaging technologies that enable new product capabilities, accelerate technology adoption, and contribute directly to Qorvo’s commercial success. The candidate will work closely with internal product teams, external partners, government sponsors, and senior leadership, to shape technology roadmaps and transition research concepts into manufacturable solutions.
Responsibilities Responsibilities
- Serve as a key individual contributor and technical leader driving next-generation wafer-level interconnect, BEOL, WLP, and heterogeneous integration research Author and influence technology roadmaps aligned to long-term product and innovation strategies Lead proposal development, technical shaping, capture, and execution of funded programs as Principal Investigator Provide technical project leadership, including planning, execution, risk management, and milestone delivery Drive hands-on process ideation, development, pathfinding, troubleshooting, and execution for wafer and wafer-level packaging technologies Collaborate with and direct technicians, junior engineers, and process engineers to execute development activities efficiently Communicate program status, technical results, and strategic recommendations to senior leadership, customers, and external stakeholders Generate valuable intellectual property, including patents, invention disclosures, and proprietary process know-how Mentor and develop junior engineers and researchers while fostering technical excellence across the team Required Experience and Skills
Minimum Qualifications (“need-to-have”)
- Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field 8+ years of hands-on semiconductor R&D experience in cleanroom fabrication environments Demonstrated expertise in semiconductor BEOL processing and/or wafer-level packaging (WLP) technologies Hands-on experience with advanced metallization, dielectric integration, and interconnect process development Proven ability to lead and guide small, multidisciplinary R&D teams Strong written and verbal communication skills, including proposal development, technical reporting, and executive-level presentations Desired Experience and Skills
Preferred Qualifications (“nice-to-have”)
- 3+ years of experience serving as a Principal Investigator, technical lead, or equivalent leader for advanced R&D programs GaN RF transistor fabrication experience Working knowledge of device and mask layout design, particularly for analog and RF applications Experience leading or executing R&D programs sponsored by U.S. Government agencies such as DARPA, AFRL, or similar organizations Expertise in advanced packaging and 3D heterogeneous integration (3DHI) technologies Hands-on experience with semiconductor process modules such as lithography (stepper and/or e-beam), etch, metallization, CMP, and SEM/FIB analysis Experience with wafer-level and chip-level integration processes, including wafer-to-wafer and die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies Experience with device processing and DC/RF characterization, including RF measurements such as S-parameters and load-pull Familiarity with epitaxial design or close collaboration with epitaxy teams Experience using data analytics and visualization tools such as Spotfire #LI-SM1 The typical base pay range for this role across the U.S. is currently USD $122,900 - $255,200 per year.
Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock.
These incentives and awards are based on individual and/or company performance. Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [email protected].