About this role
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
• New package development -from conceptualization and ideation to creation of fully functional prototypes. • Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers) • Physically conduct POC builds and/or technology demonstration with Provider • Benchmark processes/technologies • Provides POC development costing and project timing • Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow • Make sure we are covered with the Intellectual Property prior engagement • Generate/Present POC and/or Technology demonstration reports to Stakeholders • Technology Transfer to development site • Provides intelligence on Package Technology/Market • Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions. • Provides recommendations regarding technical approach or design, resource allocation, or project timing. • Works with general guidance but independently determines the best approach for solving a problem. • Conducts Design reviews and risk assessments with participation by other technical experts • Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing • Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.
• Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering • 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development • Hands-on assembly development and manufacturing experience. • Analytical skills: process, materials and assembly equipment parameters • Hands-on experience in program management