About this role
Preferred
• Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
• Prior experience in electronic packaging industry and/or chip design industry
• Established relationships within OSATs, ODMs and/or chip vendors Skills & Attributes
• Highly analytical and strategic thinker with quality and reliability of product in mind
• Skilled in DFx (x = manufacturability, reliability, and/or test)
• Comfortable in operating with ambiguity in fast‑evolving technology markets
• Excellent communication skills in English; Mandarin proficiency strongly preferred