About this role
The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context of electromobility and other high- tech applications, we investigate new approaches for using copper as a cost-efficient and high-performance material in packaging solutions. The increasing demand for compact and reliable power electronic systems drives the development of advanced die-attach technologies. Inductive sintering is a promising alternative to conventional soldering and offers fast, localized heating with reduced thermal exposure of surrounding components. Copper is particularly attractive as a sintering material due to its excellent electrical and thermal properties. In this Bachelor’s/Master’s thesis, copper sintering pastes and preforms will be investigated and compared for inductive die-attach applications. The study will focus on process performance, heating behaviour, bond-line consistency, joint quality, and porosity to evaluate the advantages and limitations of both material forms. We are looking for a motivated student to experimentally investigate and compare copper pastes and preforms for inductive sintering and contribute to the development of an efficient and reliable die-attach process. Be part of change Conduct a literature review on copper sintering, inductive heating, and porosity evaluation methods. Select and prepare suitable copper pastes and preforms for experimental testing. Prepare die-attach assemblies using both pastes and preforms. Perform experiments using an inductive sintering press under defined process conditions. Characterize the sintered joints and quantify porosity and joint properties. Compare pastes and preforms using defined process and joint-quality parameters. Analyze and document the results and compile the thesis report. What you contribute You are enrolled in a Bachelor's or Master’s program in Microsystems Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related fields. You are studying in Chemnitz, Mittweida or the surrounding area. You have basic knowledge of materials characterization. You are interested in experimental lab work. You have very good proficiency in German or English (spoken and written). You have an independent and structured working style. An average grade of < 2 completes your profile. What we offer You will work in an interdisciplinary and motivated research team. You will get access to state-of-the-art laboratory and simulation facilities. You will gain practical insights into current challenges in power electronics and packaging technologies. You will have flexible working hours and a close supervision throughout the thesis. You will benefit from a collegial, pleasant and motivating working environment. We value and promote the diversity of our employees' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Our tasks are diverse and adaptable – for applicants with disabilities, we work together to find solutions that best promote their abilities. With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future. Ready for a change? Then apply now and make a difference! Please enclose a brief cover letter, your CV, a current overview of your grades and your certificates with your application. Once we have received your online application, you will receive an automatic confirmation of receipt. We will then get back to you as soon as possible and let you know what happens next. Please address any questions you may have to Michaela Baum E-mail: [email protected] For data protection reasons, we can only consider applications via our career portal - thank you. Fraunhofer Institute for Electronic Nano Systems ENAS www.enas.fraunhofer.de Requisition Number: 85880 Application Deadline: