About this role
Create something new
You will industrialize new manufacturing processes for consumer electronics products and transfer them from development into high-volume production. In this role, you actively shape the setup of new supply chains and manufacturing models, including new technology areas such as acoustics or optics.
Assume responsibility
You are responsible for the overall coordination of external assembly suppliers in Asia and act as the primary technical and operational point of contact for all assembly-related topics. You serve as the first escalation point for supplier-related issues (from and towards OSATs) and ensure timely resolution on all levels.
Technical Leadership
You lead and develop the local assembly team by:
Providing technical consultation and guidance on complex packaging and assembly topicsCoaching and supporting team members in problem-solving and technical decision-makingDriving competence development and fostering a high-performance team environmentActing as a sparring partner for critical technical challenges in mass production and NPIInternational Team & Interface Management
You coordinate cross-functional and international teams and act as the key interface between internal stakeholders and external partners. You represent BST Operations towards suppliers and customers in Asia, including:
Leading supplier interactions, audits, and escalation discussionsActing as local management representative during customer visitsEnsuring alignment between internal requirements and supplier capabilitiesHolistic approach (Quality, Cost, Delivery)
Together with suppliers, you drive improvements to achieve quality, cost, and delivery targets in high-volume production. This includes:
Managing supplier-related improvement initiatives and escalationsChallenging interfaces to ensure balanced decision-making (e.g., PCN, RMA topics)Supporting stability and yield improvement in productionEnsuring structured problem-solving and sustainable corrective actionsHelp shape the future
You lead strategic and operational initiatives to optimize complex manufacturing processes in packaging and interconnect technologies. You:
Drive NPI readiness and industrializationBuild and enhance end-to-end manufacturing KPI and analysis systemsSupport new manufacturing concepts and long-term operational strategies Personality
Strong communication and leadership skillsAssertive, solution-oriented, and able to influence stakeholdersHigh level of initiative, ownership, and accountabilityIntercultural mindset with willingness to travelWorking style
Structured, analytical, and independent working approachStrong problem-solving mindset with focus on sustainable solutionsAbility to manage complexity and prioritize effectively in dynamic environmentsExperience and Know-how
Several years (>5–7 years) of experience in semiconductor manufacturing, assembly, or developmentDeep understanding of assembly and packaging technologiesStrong knowledge of semiconductor manufacturing processes (frontend, wafer test, OSAT, final test)Experience in supplier management, escalation handling, and high-volume production environmentsFamiliarity with quality and problem-solving methodologiesLanguages
Very good English skills (written and spoken)German or additional languages are a plusEducation
Master’s, Diploma, or PhD degree in engineering (e.g., electrical engineering, materials science, mechanical engineering, physics, or similar)