About this role
R&D areas _ Power Assembly Interconnection Technology (AIT) for automotive & semiconductor products applicationProcess development for platform and new product application , ensure industrialization friendly design conceptRisk management during development in automotive & semiconductor productsSupport plant for risk assessment and trouble shootingInnovation of new material and AITs for the next generation of automotive productsCross-functional team cooperation w/ design, plant, purchasing team in CN-,DE-,HU-,PO-… Education Background: material engineering or mechanical engineering with a master’s degree or higher;3-5 years experience in development fieldProfessional Skills:Familiar with power module production processes, Eg: sintering, soldering, bonding, welding …Machine evaluation/release experience is preferred;Problem solving methodology & Cause-effect-relationship (CER) analysis abilityFamiliar with automative & industry standards (e.g. IPC, ISO)Digitalization competence e.g. Python, Power BI & AI is a plus.Soft Skills:Team player in cross-functional local & global teamPresentation w/ storytelling Language:Fluent in English, German is a plusPersonality:Self-drivenCustomer orientationStrong ownershipCollaboration & Team work