About this role
What you will do Assembly Engineering Support Manage and support engineering builds activities of IC package assembly projects from concept to completion. Define project scope, timelines, and deliverables in alignment with assembly engineering activities. Track progress, identify risks, and implement mitigation strategies to ensure timely execution. Supplier Coordination Serve as the primary technical liaison between internal teams and OSAT partners. Coordinate and monitor assembly activities, ensuring compliance with quality, cost, and schedule requirements. Facilitate communication and alignment across global manufacturing sites and vendors. Issue Resolution & Technical Support Investigate and resolve assembly-related issues including yield loss, material defects, and process deviations. Support root cause analysis and drive corrective actions in collaboration with quality and process engineering teams. Support failure analysis and reliability testing as needed. Documentation & Reporting Maintain detailed documentation of build processes, test results, and lessons learned. Gather required documents from Assembly House like POD, substrate drawing, bonding diagram, etc. Generate technical reports and present findings to stakeholders and leadership. Support DFM & DFA review process. Continuous Improvement Identify opportunities for process optimization and cost reduction in packaging and assembly. Contribute to the development of new packaging technologies and methodologies. Who you are Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field. 5+ years of experience in semiconductor packaging or IC assembly engineering. Strong understanding of packaging technologies (e.g., wire bonding, flip chip, molding, underfill & SMT). Experience working with OSATs and managing external suppliers. Knowledgeable in data analysis tools and statistical process control (SPC). Excellent problem-solving, communication, and organizational skills. Preferred Skills Familiarity with industry standards (JEDEC, IPC). Experience with advanced packaging (e.g., 2.5D/3D IC, fan-out, wafer-level packaging, BGA, etc) assembly processes. Knowledge on reliability testing and failure analysis techniques. Ability to work in a fast-paced, cross-functional environment.