About this role
What you will do - Develop new wafer fab process modules on dry etching tools for GaN HEMT wafers (passivation, metal-etching, plasma clean) - Execute process development or integration tasks and build up product and process knowledge - Lead small or medium sized process integration or optimization projects - Sub-project leader of process development or integration tasks in complex projects - Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise - Be an active member in PC&O Process improvement teams What you will need - Masters' degree in Semiconductor Device Physics or Semiconductor Technology and/or Microelectronics - Minimum 3 years of relevant experience depending on educational credentials - Knowledge of semiconductor devices and industrial semiconductor technology - Hands on experience in wafer fab process module developments on lithography equipment - Team player with a strong drive to achieve success - Fluency in German, good level of English - Good communication skills, both verbal and written **Why work for us?** - Flexible working hours and possibility of overtime reduction to maintain a Work-Life-Balance - Unlimited employment contract with a competitive salary and supplementary voluntary employee benefits - A wide variety of training courses and career development options - Numerous further benefits, such as retirement provisions, travel allowance for the public transport ticket, company events, sports and leisure activities, employee discounts and even more Ergänzende Informationen: Anforderungen an den Bewerber: Zwingend erforderlich: Produktionsplanung, Betriebsmitteleinsatz planen, Projektierung, Fertigungstechnik