About this role
Sense the power of light The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com Your new responsibilities Process Development & Execution: Lead packaging process development procedures in OSATs, ensuring absolute alignment with product requirements, engineering specifications, and project milestones. Risk Management & Problem Solving: Systematically assess process risks for new product introductions; drive technical benchmarking, failure analysis, and structural root-cause analysis in problem solving process. OSAT Governance & Collaboration: Optimize suppliers’ technical fit and drive higher execution standards for fulfilling engineering requirements and package development roadmap; build long-term frameworks and improvement plans with key partners and explore alternative technology options. Innovation & Cross-Functional Bridge: Contribute breakthrough ideas to the technology roadmap; serve as the primary packaging process technical expert among cross-functional team. Design Rule & Specification Ownership: Manage and strengthen the OSATs’ technical capability database and package design rules for DFM. Oversee engineering design drawings reviews to ensure precise dimensions & tolerances matching with product requirements and process capability. Who we are looking for Master or above degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related disciplines. Minimum of 7+ years of solid experience in semiconductor packaging development, with a proven track record of leading complex technical projects. Direct experience in Optical Packaging, Optoelectronics, or Silicon Photonics / Datacom packaging (e.g., high-speed substrates, optical alignment, 2.5D packaging technology) is highly preferred. Subject-matter expertise in backend processes (advanced die attach, precision molding, substrate design, wafer-level packaging). Exceptional skills in advanced failure analysis, statistical tools, and DFM. Strong leadership capability to influence internal stakeholders and externally drive OSAT execution without direct authority. Fluent in English and Mandarin with excellent communication and strategic negotiation skills. Please contact I-Chen Lou for further information via [email protected] or +886 (2) 25131705 .