About this role
Key Responsibilities
• Maintain and support wire bond equipment to ensure high uptime and reliability. • Troubleshoot equipment issues and implement effective corrective actions. • Perform preventive maintenance and drive continuous equipment improvements. • Support production operations and minimize equipment downtime. • Work with Process, Production, and Quality teams to improve yield and product quality. • Lead and drive equipment qualification, sustaining , upgrade and automation projects. • Analyze equipment performance data and implement productivity improvements. • Develop and maintain maintenance procedures, work instructions, and technical documentation. • Train and mentor technicians on equipment operation and troubleshooting. Requirements
• Bachelor's degree or above in Engineering related field (Mechanical, Electrical are preferred). • Minimum 3 years of semiconductor manufacturing experience. • Strong troubleshooting and root cause analysis skills. • Familiar with SPC, FMEA, 8D, and continuous improvement methodologies. • Good communication and teamwork skills. • Able to support a fast-paced manufacturing environment. Preferred Qualifications
• TOEIC >600 or other English comprehensive certification • Experience with wire bonder, eg K&S Rapid; ASM AERO...etc • Knowledge of automation, SECS/GEM, and equipment data analysis. • Six Sigma Green Belt or equivalent certification.
More information about NXP in Greater China...
#LI-2370