About this role
Summary Atomica is seeking a driven Process Engineer to join our Surface Engineering, with a primary focus on deposition. We are looking for someone who can support existing production processes and develop processes for new programs (20+) focusing on product quality and manufacturability. Collaboration is a must as you work closely with the integration, manufacturing engineering, maintenance and production teams on development of new processes, sel ection of new equipment/technology, standardization and problem resolution. This role is designed for a technical leader who thrives at the intersection of advanced materials and complex vacuum hardware. Primary Responsibilities 1. New Process & Tool Development End-to-End Development: Design and execute recipes for new thin-film applications, ensuring strict adherence to required material properties (mechanical, optical and electrical characteristics). Integration Collaboration: Partner with the integration team to ensure surface engineering solutions meet fu nctional requirements for complex devices Tool Qualification: Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards. DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results. Strong fundamentals in data analysis and demonstrated critical thinking skills 2. Advanced Troubleshooting & Root Cause Analysis Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while maintaining the discipline to lead "Task Force" efforts for chronic production excursions. Hardware-Process Mastery: Act as the primary technical expert for resolving complex process-hardware interactions. Tool Troubleshooting: Help perform diagnostics on vacuum systems, RF power delivery, and gas flow controllers. Hands-on experience is highly valued. 3. Sustaining & Standardization Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long-term process stability. Standardization: Author and maintain high-quality Standard Operating Procedures and technical documentation to ensure cross-shift consistency. Technical Expertise Preferred Deposition (Primary Focus) PVD: Experience with RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD) and E-beam evaporation CVD & ALD: Deep knowledge of PECVD, HDPCVD, ALD, and LPCVD. Thermal: Proficiency in oxidation furnaces, annealing, and RTP/RTA. Dry Etch & Clean Plasma Processing: Hands-on experience with Bosch process (DRIE), dielectric etching, plasma ashing, and Ion Beam Etching (IBE) Required Qualifications B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline. 5+ years of experience in a semiconductor microfabrication manufacturing environment. Deep understanding of material properties and the specific process knobs required to obtain them. Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE. Proven track record of "hands-on" hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum-related failures.