About this role
1.Coordinate with respective backend NPI engineering teams the processing of technology-transfer lots from wafer fabrication out through wafer sort, characterization, qualification, and safe launch 2. Work with Fab Process Engineering and Process Integration to review process transfer status, risks, and action items. 3. Drive lot track schedules, milestones, and issues; communicate risks to the Technology Transfer Project Lead and Product Engineering Director. -Wafer Yield & Data Analysis 1.Review wafer sort data, wafer maps, WAT/PCM data, electrical yield, and parametric distributions. 2. Identify process-related yield loss, electrical anomalies, and parametric shifts. 3. Work with Fab Yield and Process Engineering teams on root-cause analysis, corrective actions, and yield improvement during safe launch through to product maturity. -Product Release Coordination - Probe, Characterization, Reliability Testing 1. Project coordinates the following key activities in the product transfer cycle 2. Wafer probe and engineering characterization activities before package assembly. 3. DC and AC characterization within the characterization team and support correlation between wafer probe, final test, and reliability data. 4. Assembly, Final Test, Reliability, Failure Analysis, Quality, Operations, and Supply Chain to support product release. 5. Interface with reliability teams for AEC-Q101 reliability tests such as HTRB, HTGB, Temperature Cycling, Power Cycling, HAST, THB, HTSL, Autoclave, and package qualification testing. 6. Support failure analysis reviews when yield, qualification, or test issues occur. 7.Prepare engineering build reports, yield summaries, qualification updates, and manufacturing readiness materials. 115年8月15日（六）Team Taipei 挺就業「青年 ✦ 科技 ✦ 未來」AI產業鏈就業博覽會 活動時間：115年8月15日（六）10：30 ～16：00 (請於15:30前入場) 活動地點：圓山花博爭艷館（臺北市中山區玉門街1號） 洽詢電話：02-2338-0277 *****請親洽***** 想要知道更多活動資訊詳情，請於台北就業大補帖官網查詢 https://okwork.gov.taipei