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Mechanical Modeling Scientist (Taipei, TW, 114) @ Corning

Taipei, TW, 114OnsiteFull-time
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<div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px">Role Purpose</H2> </div><div><p><span style="font-family:arial, helvetica, sans-serif;font-size:10.0pt">The role is responsible for developing and delivering mechanical/thermal finite element analysis to address customer-related issues to support different Corning businesses. The role will serve as the point of contact for modeling requests from local regions. The role will need to be able to complete modeling tasks independently and deliver results clearly without supervision. Strong connections to Corning global technology communities need to be developed to leverage exiting capabilities through collaborations. The role will present our solutions to local customers as a regional representative in mechanical modeling.</span></p></div></div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px">Key Responsibilities</H2> </div><div><ul> <li style="font-size:12.0pt;font-family:Arial, sans-serif"><span style="font-size:10.0pt">Serve as a primary technical point of contact for </span><span style="font-size:10.0pt">mechanical/thermal modeling requests for local requests in Asia Pacific regions</span></li> <li style="font-size:12.0pt;font-family:Arial, sans-serif"><span style="font-size:10.0pt">Fulfill modeling requests from local customers by collaborating with Corning modeling communities and local customer-facing teams </span></li> <li style="font-size:12.0pt;font-family:Arial, sans-serif"><span style="font-size:10.0pt">Develop and perform finite element modeling to provide design guidelines to address customer’s issues or enable internal understanding</span></li> <li style="font-size:12.0pt;font-family:Arial, sans-serif"><span style="font-size:10.0pt">Coordinate experimental efforts internally or externally for model validation </span></li> </ul></div></div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px">Experiences/Education - Required</H2> </div><div><ul> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Master&apos;s or Doctorate Degree in Mechanical Engineering, Applied Science, or equivalent fields.</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">3+ years for master’s degree or 1+ years for doctorate degree, of experience in finite element modeling for mechanical, thermal, and thermal-mechanical analysis</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">2+ years of experience in consumer electronics or semiconductor industries</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Experience in performing mechanical/thermal finite element analysis using commercial software such as Ansys, Abaqus, COMSOL Multiphysics, and LS-DYNA, using both implicit and explicit solvers</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Expertise in solid mechanics, heat transfer, material science, and fracture mechanics</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Familiarity with glass applications in consumer electronic devices and semiconductor processes</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Experience in cross-team collaboration and project management</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Fluent in English and Mandarin</span></li> </ul></div></div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px">Experiences/Education - Desired</H2> </div><div><ul> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Coding skill to enable programmable simulation using Python, Fortran, etc.</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Work experience as R&amp;D, engineering, manufacturing, or product development roles</span></li> <li style="margin-top:0.0cm;margin-right:0.0cm;margin-bottom:0.0cm;font-size:10.0pt;font-family:arial, helvetica, sans-serif"><span style="font-size:10.0pt;font-family:arial, helvetica, sans-serif">Knowledgeable about strength test methods, e.g. 4-point bending tests</span></li> </ul></div></div></div>

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