About this role
Physics AI - Thermal-Mechanical Reliability at Flexcompute Inc.. Location: Watertown, Massachusetts, United States. Role: lead strategy, design workflows, recruit engineers Requirements: PhD in Mechanical Engineering, Materials Science, Physics or related field; 10+ years in semiconductor/microelectronics; expertise in 3D-IC reliability, warpage, interfacial delamination, and thermal-mechanical coupling; GPU-accelerated AI/simulation experience. Category: Research and Development (R&D) Seniority: Senior Level Tools: GPU acceleration, FEA, Multi-physics, Python, Machine Learning, GPU Solvers, 3D-IC, TSV Commitment: Full Time Workplace: Onsite Languages: English