About this role
(高雄)先進封裝技術製程開發工程師 (高雄，台灣, TW) at Winbond. Location: Kaohsiung, Taiwan, Taiwan. Role: developing processes, evaluating equipment, leading projects Requirements: Master's degree in engineering or related fields; 3+ years in advanced packaging, processing integration; English intermediate; willingness to travel not required; experience with HBM, hybrid bonding, 2.5D CoWoS, HBPOP, and PKG thermal/stress simulation preferred. Category: Research and Development (R&D) Seniority: Mid Level Tools: HBM development, hybrid bonding, 2.5D CoWoS, HBPOP process, thermal and stress simulation Commitment: Full Time Workplace: Onsite Languages: English, Chinese