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Mechanical and Thermal Analysis of Advanced Packaged Devices Intern @ Advanced Micro Devices, Inc

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About this role

Mechanical and Thermal Analysis of Advanced Packaged Devices Intern at Advanced Micro Devices, Inc. Location: Singapore, Singapore, Singapore. Role: Design experiments, Analyze data, Collaborate with teams Requirements: Pursuing or recent Master’s/PhD in Materials Science, Mechanical or Electrical Engineering; strong data analysis (MATLAB/Python); good communication; able to work independently. Category: Research and Development (R&D) Seniority: No Prior Experience Required Tools: MATLAB, Python, Excel Commitment: Internship Workplace: Onsite Languages: English

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