About this role
Alleviating Thermal Challenges In Angstrom Nodes: Paving The Way For 3D Integrated Circuits (3D-ICs) at imec. Location: Leuven, Flemish Brabant, Belgium. Role: conducting research, analyzing data, publishing results Requirements: Research role focused on thermal challenges for angstrom-scale nodes and 3D integrated circuits; based in Leuven, Belgium. Category: Research and Development (R&D) Seniority: Entry Level Commitment: Full Time Workplace: Onsite Languages: English