About this role
EUV Mask Technology FEOL RND Engineer at Micron Technology. Location: Boise, Idaho, United States. Role: developing materials, advancing readiness, translating requirements Requirements: MS required (PhD preferred) in materials-related field, 2+ years semiconductor process or research experience, experience with mask/lithography and tool/supplier collaboration, strong lithography fundamentals and data-driven R&D skills. Category: Engineering Seniority: Entry Level Tools: OPC, EUV, DUV, High-NA EUV, actinic mask inspection Commitment: Full Time Workplace: Onsite Languages: English