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Advanced Packaging Lithography Development Manager @ Intel

USOnsiteFull Time
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About this role

Advanced Packaging Lithography Development Manager at Intel. Location: Hillsboro, Oregon, United States. Role: leading team, developing processes, improving yield Requirements: Master's or PhD in engineering or related field, 5–6+ years relevant lithography/process development experience, equipment expertise (ASML, Canon, Nikon, track), project management and people leadership. Category: Research and Development (R&D) Seniority: Senior Level Tools: ASML, Canon, Nikon, scanner/stepper systems, track equipment, Design of Experiments (DOE) Commitment: Full Time Workplace: Onsite Languages: English

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