About this role
Package Architect at Nexperia. Location: Dallas or Richardson. Role: leading packaging, driving strategy, mentoring teams Requirements: Lead packaging strategy; bachelor's in engineering; 8+ years in semiconductors; 7+ years in packaging, DoE, data analysis, and reliability tests; 5+ years in project management; travel up to 5%. Category: Engineering Seniority: Senior Level Tools: Six Sigma, DoE, Data analysis, Semiconductor packaging, Reliability testing, Package design Commitment: Full Time Workplace: Hybrid Languages: English