About this role
Lead Engineer, Package Development & Engineering at Micron. Location: Singapore or Singapore. Role: Lead programs, Governance enforcement, Strategic alignment Requirements: Lead technical programs in advanced packaging; 8+ years in semiconductor packaging; strong leadership and communication; expert in packaging flows (hybrid bonding, CoWoS, chiplet). Category: Engineering Seniority: Senior Level Tools: Simulation, Modeling, Yield analysis Commitment: Full Time Workplace: Onsite Languages: English