About this role
Die Bond工艺工程师 (9918) at JCET. Location: Shanghai, China. Role: leading research, resolving bottlenecks, overseeing npi Requirements: Lead packaging technology research, resolve process bottlenecks, support NPI and factory-of-future projects; requires bachelor\u0002s in related field, 5+ years packaging/semiconductor experience, and strong English. Category: Engineering Seniority: Senior Level Commitment: Full Time Workplace: Onsite Languages: English, Chinese