About this role
Director, Advanced Packaging Lab (HIT) at Advanced Micro Devices, Inc. Location: Singapore, Singapore, Singapore. Role: Lead, Collaborate Requirements: Lead the Singapore Advanced Packaging Lab; manage metrology across optical, electrical, mechanical, thermal, and imaging domains; build partnerships with external labs and vendors; align with AMD's AI packaging strategy. Category: Engineering Seniority: Senior Level Commitment: Full Time Workplace: Onsite Languages: English