About this role
Packaging Module Development Engineer at Intel. Location: Phoenix or Chandler. Role: developing process, optimizing equipment, driving improvements Requirements: Bachelor's or MS in engineering/materials/physical science, 4+ years process development and DOE experience, materials characterization (DSC,TGA,D/TMA,ICPMS,FTIR,SEM), EM data analysis, and troubleshooting skills. Category: Engineering Seniority: Mid Level Tools: DSC, TGA, D/TMA, ICPMS, FTIR, SEM, Microsoft Office Commitment: Full Time Workplace: Onsite Languages: English